Surfaces, Interfaces, and Applications
- Xi Chen*
Xi Chen
College of Materials and Chemistry & Chemical Engineering, Chengdu University of Technology, Chengdu, Sichuan 610059, China
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong 518055, China
*Email: [emailprotected]
More by Xi Chen
- Shifang Duan
Shifang Duan
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong 518055, China
More by Shifang Duan
- Dezhou Cao
Dezhou Cao
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong 518055, China
More by Dezhou Cao
- Jinyao Tang
Jinyao Tang
Department of Chemistry, The University of Hong Kong, Hong Kong 999077, China
HKU-CAS Joint Laboratory on New Materials and Department of Chemistry, Hong Kong 999077, China
State Key Laboratory of Synthetic Chemistry, The University of Hong Kong, Hong Kong 999077, China
More by Jinyao Tang
- Xing Ma
Xing Ma
School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
More by Xing Ma
- Ting Kuang
Ting Kuang
Education Center of Experiments and Innovations, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
More by Ting Kuang
- Shuailong Zhang
Shuailong Zhang
School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
Chongqing Institute of Microelectronics and Microsystems, Beijing Institute of Technology, Chongqing 400000, China
More by Shuailong Zhang
- Wei Wang*
Wei Wang
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong 518055, China
*Email: [emailprotected]
More by Wei Wang
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ACS Applied Materials & Interfaces
Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX
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https://pubs.acs.org/doi/10.1021/acsami.5c02233
Published April 22, 2025
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Transporting and assembling colloidal particles is key to applications such as drug delivery, the fabrication of functional materials, and microrobotics. As a result, there is intense effort in developing techniques for manipulating colloids at high spatial and temporal resolutions, and in a dynamic, reconfigurable manner. Although optical manipulation provides precise particle control, its application is often limited by high energy requirements and intricate setups. In this study, we present an opto-chemical-electronic tweezer (OCET), a novel particle manipulation strategy that addresses these limitations. The OCET system utilizes a photocatalytic TiO2/Pt film irradiated with perpendicular UV light. An electric field is then generated parallel to the film at the boundary of the patterned UV light, directed from the illuminated region to the dark region. The consequent electrophoresis and electroosmosis work in tandem to move inert colloidal particles (e.g., SiO2 microspheres) at ∼1 μm/s and trap them a few μm inside the illuminated region along the boundary of the light pattern. By dynamically modulating light patterns, the OCET system achieves directional particle transport and reconfigurable colloidal assembly into arbitrary patterns. The OCET system holds promise for applications in optofluidics, micro/nanorobotics, and biomedical systems, setting the stage for further advancements in optical manipulation technologies.
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© 2025 American Chemical Society
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- Colloidal particles
- Electric fields
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- Oxides
- Platinum
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ACS Applied Materials & Interfaces
Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX
Click to copy citationCitation copied!
Published April 22, 2025
Publication History
Received
Accepted
Revised
Published
online
© 2025 American Chemical Society
Request reuse permissions
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